Tillitis AB sponsors GlobalFoundries 180MCU development for Tiny Tapeout
First 2 of 4 work packages underway, with support from wafer.space, IEEE, and Synopsys.
Tiny Tapeout Team
•1 August 2025
Tillitis - GlobalFoundries - Tiny Tapeout
We’re expanding Tiny Tapeout to a new process node!
At FSiC 2025, we announced that Tillitis AB is sponsoring work to bring GlobalFoundries 180MCU into the Tiny Tapeout ecosystem.
The effort is structured in 4 work packages. The first 2 are already underway:
The first focuses on getting a minimum viable chip through the submission loop, targeting either wafer.space or a Synopsys-sponsored shuttle by September 2025.
The second will deliver a digital-only minimum viable Tiny Tapeout chip, expected through wafer.space by October-November 2025.
We’re grateful for early letters of support from Wafer.Space, IEEE electron devices society, and Synopsys Inc. They all reinforce the momentum for regular GF shuttles aimed at learning, training, and workforce development.
We’re still looking for sponsors for the remainder of the work, which will add complete support for analog and mixed signal. If you’re interested in partnering to grow this initiative, let’s talk!
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Last modified by Matt Venn on 24 July 2026. Commit 69cd11e. Suggestions?